Innovation Mission Taiwan: Integrated Photonics, Advanced Packaging, and Quantum Technology
Are you active in the field of integrated photonics, advanced packaging of semiconductors, or quantum technology, and are you interested in exploring the opportunities and developments of these key technologies in Taiwan with us? Then join this innovation mission to Taiwan from 2-6 September 2024.
Mission objectives
- Strengthening relationships with potential partners for joint research, development, and commercialisation of technological innovations in the production of photonic chips, advanced packaging, heterogeneous integration, chiplet technology, compound semiconductor materials, and quantum technology.
- Intensifying bilateral cooperation between government, business, and knowledge institutions.
- Further developing bilateral arrangements and programmes to support cooperation.
The Netherlands Enterprise Agency (RVO) is organising this mission in close cooperation with PhotonDelta. Deadline for registration is 15 May 2024.
More information & registration (NL)
Upcoming events
13
April until 13 Oct
Expo 2025 Osaka
Japan
16
September Inclusive Chips Forum
High Tech Campus, Eindhoven (NL)
09:30
-
17:00
17
September until 18 Sep
Forming Technology Forum 2025: Hybrid Modelling in Forming Processes
Universiteit Twente, Enschede (NL)
18
September Dutch Photonics Event 2025
Enschede (NL)
19
September Information meeting KIC call: Demand-driven Research by Consortia – XL
Online