Innovation Mission Taiwan: Integrated Photonics, Advanced Packaging, and Quantum Technology
Are you active in the field of integrated photonics, advanced packaging of semiconductors, or quantum technology, and are you interested in exploring the opportunities and developments of these key technologies in Taiwan with us? Then join this innovation mission to Taiwan from 2-6 September 2024.
Mission objectives
- Strengthening relationships with potential partners for joint research, development, and commercialisation of technological innovations in the production of photonic chips, advanced packaging, heterogeneous integration, chiplet technology, compound semiconductor materials, and quantum technology.
- Intensifying bilateral cooperation between government, business, and knowledge institutions.
- Further developing bilateral arrangements and programmes to support cooperation.
The Netherlands Enterprise Agency (RVO) is organising this mission in close cooperation with PhotonDelta. Deadline for registration is 15 May 2024.
More information & registration (NL)
Upcoming events
16
March until 19 Mar
Innovation Mission to Grenoble | Dutch Semiconductor
Grenoble (FR)
18
March CareBOTS 2026
Veldhoven (NL)
14:00
-
18:00
20
March Special session on Optomechatronics and Metrology
Delft (NL)
09:45
-
14:00
24
March Networkevent Themetables Key Enabling Technologies and Digitalisation
Arnhem (NL)
11:00
-
17:00
26
March until 28 Mar
EUDIS Defence Hackathon 2026: Defending Airspace
Katwijk aan Zee (NL)