Innovation Mission Taiwan: Integrated Photonics, Advanced Packaging, and Quantum Technology
Are you active in the field of integrated photonics, advanced packaging of semiconductors, or quantum technology, and are you interested in exploring the opportunities and developments of these key technologies in Taiwan with us? Then join this innovation mission to Taiwan from 2-6 September 2024.
Mission objectives
- Strengthening relationships with potential partners for joint research, development, and commercialisation of technological innovations in the production of photonic chips, advanced packaging, heterogeneous integration, chiplet technology, compound semiconductor materials, and quantum technology.
- Intensifying bilateral cooperation between government, business, and knowledge institutions.
- Further developing bilateral arrangements and programmes to support cooperation.
The Netherlands Enterprise Agency (RVO) is organising this mission in close cooperation with PhotonDelta. Deadline for registration is 15 May 2024.
More information & registration (NL)
Upcoming events
19
February until 20 Feb
Successful R&I in Europe 2026: European networking event for Horizon Europe
Düsseldorf (D)
26
February RAI Business Platform at Hyster-Yale
Nijmegen (NL)
12:00
-
17:00
2
March Collaborative workshops KIC call Adaptivity in transitions
NWO, Utrecht (NL)
12:00
-
18:00
2
March Matchmaking: KIC-call | Heterogeneous development solutions for semiconductors & Scaling up quantum technologies
NWO, Utrecht (NL)
12:30
-
16:00
10
March until 12 Mar
JEC World 2026
Paris (FR)