Innovation Mission Taiwan: Integrated Photonics, Advanced Packaging, and Quantum Technology
Are you active in the field of integrated photonics, advanced packaging of semiconductors, or quantum technology, and are you interested in exploring the opportunities and developments of these key technologies in Taiwan with us? Then join this innovation mission to Taiwan from 2-6 September 2024.
Mission objectives
- Strengthening relationships with potential partners for joint research, development, and commercialisation of technological innovations in the production of photonic chips, advanced packaging, heterogeneous integration, chiplet technology, compound semiconductor materials, and quantum technology.
- Intensifying bilateral cooperation between government, business, and knowledge institutions.
- Further developing bilateral arrangements and programmes to support cooperation.
The Netherlands Enterprise Agency (RVO) is organising this mission in close cooperation with PhotonDelta. Deadline for registration is 15 May 2024.
More information & registration (NL)
Upcoming events
17
July Robocup 2024
TU Eindhoven (NL)
2
September Innovation Mission Taiwan: Integrated Photonics, Advanced Packaging, and Quantum Technology
Taiwan
4
September Holland High Tech Pavilion at SEMICON Taiwan 2024
Taiwan
18
September Kunststoffenbeurs 2024
Brabanthallen, 's-Hertogenbosch (NL)
18
September ESA Industry Space Days 2024
ESTEC Noordwijk (NL)