This project addresses the need for reliable wafer-to-wafer bonding as a basis for 3D chip integration, which is required to overcome current technological limits and thereby enabling the continued traditional transistor scaling.
Where current bonding processes rely heavily on empirical optimization, this research will focus on developing predictive models linking surface activation processes, surface morphology and environmental conditions to the resulting bond strength. These models will capture how short- and long-wavelength roughness, contact angle, and chemical surface state determine the resulting bond strength, supported by standardized bond strength protocols.
The results will not only deepen the fundamental understanding of the hydrophilic wafer bonding process but also contribute to a more predictable and higher-yield 3D integration process in the semiconductor industry.