Continuously improving semiconductor manufacturing equipment is essential for the production of advanced chips, especially for SiC semiconductors for the next generation of power devices that will play a crucial role in the energy transition and sustainability, digitalization and smart industry, and the circular economy.
SiC semiconductors offer a number of advantages over silicon, including 10x the electrical break down field strength, 3x the bandgap and thermal conductivity, and enable a wider range of p- and n-type control. This results in breakthrough performance not possible with silicon, making SiC the most viable successor for the next generation of power devices.
This project drives breakthrough innovation in Wafer-Fab equipment for the production of SiC semiconductor materials and the processing of SiC wafers via epitaxial deposition. Close collaboration with industrial partner Schunk Xycarb Technology will boost industrial applications and valorization of the results and fundamental knowledge developed in this project.