This project by ASML and the University of Twente aims to push forward chip-making technology by developing technology for the next generation of Extreme Ultraviolet (EUV) lithography machines: Hyper-NA. To achieve even higher precision "Hyper-NA" EUV tools will requires ultra-fine alignment capabilities.
Impact
A key solution involves using special multilayer materials that can be made thinner or thicker by heating them up such as to maintain the wafer exactly in-focus. This innovation will help enable EUV scanners to produce more powerful, efficient chips while supporting Dutch leadership in cutting-edge materials science and precision engineering.