FononTech is pioneering Impulse Printing™, a breakthrough technology designed to revolutionize 3D chip interconnects in the semiconductor industry. As traditional scaling approaches reach physical and economic limits, innovation in advanced packaging has become critical.

Impulse Printing enables the rapid and precise fabrication of ultra-small, high-speed 3D interconnects, offering a cost-effective and scalable alternative to existing techniques like hybrid bonding. Developed from research at TNO Holst Centre and now commercialized by FononTech, this technology has the potential to strengthen the Dutch high-tech ecosystem in semiconductor back-end processing. The project aims to optimize wafer handling and electrical contact technologies to enhance reliability and manufacturability.

Key benefits of Impulse Printing™

1. Faster interconnect fabrication (minutes vs. hours), 2. More precise and cost-efficient than existing solutions, 3. Scalable for AI, memory, photonics, and automotive applications, 4. Sustainable, reducing waste compared to traditional lithography-based interconnect methods

The research and development efforts, supported by Holland High Tech, focus on prototyping a new wafer holder system with high-power electrical contacts to enable large-scale adoption. The successful implementation of Impulse Printing could drive European semiconductor independence and strengthen Dutch leadership in advanced packaging technologies.