3D Integration of Micro Components | Roadmap semiconductor equipment event
This event focuses on 3D integration of micro components from an industry, user and machine maker’s perspective. Domains addressed: application domains and machine, technology perspective and metrology domains.
What opportunities does this entail for Small Medium Enterprises? Learn about the directions, applications and challenges and discuss with other participants.
- Date: Thursday, 15 September 2022
- Check-in: 12.30h
- Programme: 13.00-17.30h
- Location: Igluu Eindhoven
This event is an initiative of our roadmap Semiconductor Equipment team, in cooperation with High Tech NL/Holland Semiconductors.
Powered by our MIT-Network activities (MIT-regeling-NetwerkAciviteiten) grant.
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