As the largest semiconductor manufacturer, Taiwan plays a key role in the development of integrated photonics and advanced semiconductor packaging. Are you active in these areas? And are you interested in exploring the opportunities and developments of these industries in Taiwan? Then join us on an innovation mission to Taiwan from 4 to 8 September.

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Purpose

The purpose of this mission is to explore and seek new partnerships for joint research, development and commercialization of technological innovations within:

• Photonic chip technology
• Advanced packaging
• Heterogeneous integration and chip technology
• Compound semiconductor materials and applications, such as LIDAR, medical sensing and health monitoring