The next generation of (Moore than Moore) microelectronics requires advanced technology and highly specialized equipment. This offers new opportunities for Europe and can help to bring production back to Europe and thus help to achieve the EU growth target towards 20% global market share in 2030.
This project is part of Holst Centre’s open innovation programs. It wants to play a crucial role in this, by advancing the state of the art in the key enabling technology ‘microelectronics’. More specifically, Holst Centre’s research activities in this program will focus on ‘Laser-based Assembly and Interconnect Technologies‘ and ‘Smart Edge Computing’.
In the first activity we create Laser-based Assembly and Interconnect Technologies for a next generation of microelectronics. The ‘Smart Edge Computing’ activity advances o.a. neuromorphic computing, next-generation wireless connectivity and sensing and sensor fusion with the overall aim to realize power-efficient computing and sensing solutions.